Nitto Denko America, Inc. and Nitto Denko Automotive, Inc. - Pressure Sensitive Tapes
Search:  
Investors
 Products by Industry
 Products by Function
HOME > PRODUCTS > PRODUCTS BY FUNCTION > SEMICONDUCTOR PROCESSING MATERIALS > EPM - ELECTRONIC PROCESS MATERIALS > TAPE ELEP HOLDER FOR THE BACKGRIND PROCESS
General Description

Tape ELEP Holder for the Backgrind Process

Tape ELEP holder for protection or fixing of semiconducting wafers in the backgrind process
 
Wafer protection/fixing tape for use during the backgrind process, suitable for any kind of wafer.
This tape for the protection or fixing of wafers boasts excellent characteristics and high reliability. It is produced in a clean environment of the highes level, and the line-up has been prepared to offer a variety of types differentiated by substrate, thickness and adhesive used.

Features

Product Construction


Properties


*CAUTION: The above are typical values and should not be used in writing specifications. Customer is responsible to ensure product meets intended application requirements before approved for use.



 

Contact Us

Contacts Click Here

Featured Product

SPV 224LB
Surface Protective Film for Heavy Processing and Deep Drawing
ContactsLearn More

No. 5000NS
Double Coated Adhesive Tape with Easy Removal and Strong Adhesion, to Low Surface Energy Substrate, 6.3 mil Adhesive, Paper Liner
ContactsLearn More

P-440 NAT
4 Mil Silicone PTFE Film Tape
ContactsLearn More


Home Sitemap Privacy Policy