Nitto Denko America, Inc. and Nitto Denko Automotive, Inc. - Pressure Sensitive Tapes
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HOME > PRODUCTS > PRODUCTS BY FUNCTION > SEMICONDUCTOR PROCESSING MATERIALS > EPM - ELECTRONIC PROCESS MATERIALS > TAPE ELEP HOLDER FOR THE DICING PROCESS
General Description

Tape ELEP Holder for the Dicing Process

Tape ELEP holder for the protection or fixing of semiconducting wafers in the dicing process
 
Actively used in the dicing process. A tape used for protection or temporary holding of wafers, able to handle chips of any size.
The semiconductor industry continues to make ever-more high-level advances. In order to support the manufacturing processes in this rapidly developing industry, Nitto Denko provides the tape 'ELEP holder' for the protection and fixing of semiconducting wafers, and the 'NEL series' of automatic ELEP holder affixing equipment as a system.
 
 
  • Nun UV (low adhesion type)
  • UV curing (mainly Si wafer)
  • UV curing (for special substrate)

Features

Product Construction


Properties


*CAUTION: The above are typical values and should not be used in writing specifications. Customer is responsible to ensure product meets intended application requirements before approved for use.



 

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