molding compound, semiconductor encapsulating material, semiconductor.

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Chip Scale Package Carrier Tape

EPM - Electronic Process Materials

Molding Compound

Semiconductor Encapsulating Materials

NT-8000/8500 Series

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HOME > PRODUCTS > PRODUCTS BY INDUSTRY > SEMI CONDUCTOR > SEMICONDUCTOR ENCAPSULATING MATERIALS > MOLDING COMPOUND

Molding Compound

Nitto Denko offers a variety of clear epoxy resins for transparent encapsulation of optical-semiconductor devices such as LEDs, various optical sensors and other optical devices.

NT-8000/8500 Series:

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